Face plate and memory chip double low fan, samSung predicts first quarter outstanding achievement under anticipate

According to information of Peng rich company, because show face plate and environment of memory chip market are abate, outstanding achievement may anticipate under the market first quarter.

SamSung says, because the yield of manufacturer of Chinese face plate can be outspread,increased the supply of off-season face plate, price of indication face plate falls anticipate; more than and confuse, memory chip price drops to also anticipate more than. Express after SamSung, will use resource effectively to come huff competition ability.

Face plate and memory chip double low fan, samSung predicts first quarter outstanding achievement under anticipate

Before this, samSung was announced be spent up to the the four seasons December 31, 2018 and 2018 money year financial outstanding achievement. Among them, amalgamative battalion controls company quarter for 59.27 trillion Han yuan, relatively on year the corresponding period drops 10% , quarterly business profit is 10.8 trillion Han yuan, drop 29% .

2018, samSung announces battalion to receive two hundred and forty-three thousand seven hundred and seventy billion Han yuan, business profit is 58.89 trillion Han yuan. Although adverse business and macroscopical economy element bring about outstanding achievement of the last quarter to put delay, but be being returned in respect of financial outstanding achievement is successive the 2nd year of refresh record.

In 2019, because the performance of memory business is weaker, the company predicts integral year profit will drop somewhat. Predicting memory product and demand of OLED face plate will begin get warm again after a cold spell in second half of the year.

Suffer 2019 of second half of the year seasonal influence, the high density trend of main application develops continuously, the demand of memory will begin to anabiosis gradually from the 2nd quarter. As NAND price glide, order form of set of chip of high density NAND subsequently and come, the demand of all application will increase somewhat.

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